During our time in Taiwan for the GIGABYTE Open Overclocking Championship 2009, we had the opportunity to take a peek at GIGABYTE's upcoming motherboard lineup, as well as examine the company's new software and technological innovations. In total, GIGABYTE were showing off 28 models, a significant number of which were current models that have been updated or refreshed with new features. This shows that the company is focused on continually developing and improving the base features list of all its motherboards. However, there were obviously some sweet new models as well. The centerpiece of the showroom was without a doubt the hotly anticipated new GA-EP55 motherboard series. GIGABYTE had four nearly production-ready P55 motherboards on the display for the upcoming Intel Lynnfield LGA1156 processors. As expected, this new EP55 series utilizes the Ultra Durable 3 technology that was first introduced with the EP45 series, namely the 2 oz copper PCB, long-lasting Japanese capacitors, and Lower RDS(on) MOSFETs, and robust ferrite core chokes.
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