Over the past several months, I have read an unreasonable number of discussion forum posts which offer inaccurate and often times incorrect information. It's not really all that surprising to read poorly conceived information on the Internet, which seems to be an anonymous means of passing off opinion for fact. As a general rule we don't let too many things go untested, and the advice of wanna-be experts is not doing the hardware enthusiast and overclocker community any good. In this article, Benchmark Reviews dispels myth and establishes fact on the topic of proper application of Thermal Interface Material.
These days, Intel and AMD are producing very efficient central processing units that put out far less heat than prior generations. The CPU powering my primary workstation uses the Intel E8200 processor, which is rated for 65 watts using the 45 nm fabrication process. The constant production refinement has allowed the new 2.66 GHz E8200 to operate at the roughly the same Thermal Design Power (TDP) of an old P4 HT 2.66 GHz, but at the same time offer multiples more performance power. The trend of power efficient central processors is slowly making its way into graphics processors, too. The lesson we are learning in 2008 is that size matters, except that instead of skyscraper sized CPU coolers we are trying to reduce the footprint and shrink the area consumed by our systems.
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